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PCB Design Capabilities |
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Board Manufacturing
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- Schematic capture & bill of materials generation
- High-density, high-layer-count boards
- Analog, digital and RF board designs
- Single-sided, double-sided, and multi-layer boards
- Blind and Buried Via
- BGA, uBGA and TQFP
- Surface mount, through-hole, mixed technology
- Differential pairs, controlled impedance and distributed capacitance
- High speed rules
- Rigid and flexible circuits
- Auto and Hand routing
- Library component creation (SMT Plus, IPC)
- Full Design Rule Checking (DRC)
- Design for manufacturability (DFM)
- Design for testability (DFT)
- Post Layout Signal Integrity Check
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- Prototype board kitting and assembly
- Board manufacturing domestic and offshore sourcing and management
- Referrals to quality board fabricators and contract manufacturers
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Documentations
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- Schematic drawings, bill of materials
- Fabrication drawing, assembly drawings, fabrication panel drawings
- SMT stencil artwork, CAM X-Y data file
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Design Tools |
- Power PADS
- Cadence Allegro, Specctra Autorouter
- OrCAD Schematic Capture, Layout Plus
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